Singapore’s Nexstrom Raises $12 Million to Bring 2D Semiconductors to Chip Manufacturing

Singapore semiconductor startup Nexstrom is developing technology designed to bring ultra-thin two-dimensional (2D) semiconductor materials into commercial chip manufacturing. The company believes these materials could help address challenges created as traditional silicon transistor scaling becomes more difficult.

For decades, chipmakers have improved performance by shrinking silicon transistors and increasing transistor density. However, smaller transistors create new challenges, including greater difficulty controlling electron movement, which can lead to power loss, leakage, and heat problems.

Building Chips With 2D Materials

Nexstrom is focused on transition-metal dichalcogenides (TMDs), a class of materials only a few atomic layers thick. While they are not literally two-dimensional, their extreme thinness has made them a potential option for future semiconductor designs.

The company is developing equipment and processes that can grow TMD materials directly onto 300mm wafers used in commercial chip production. Nexstrom’s system, called North Star, is designed to help semiconductor manufacturers create these thin materials at larger scale.

Research into 2D materials has grown across the semiconductor industry. Studies published in journals including Nature Nanotechnology and Nature Communications have explored the potential of advanced materials for future electronic devices.

Working Alongside Chip Industry Leaders

Nexstrom is not attempting to compete directly with major chip manufacturers such as TSMC, Samsung, and Intel. Instead, the company plans to provide manufacturing technology and partner with semiconductor companies.

Major industry players are also exploring 2D semiconductor integration. TSMC, ASML, and Belgium-based research organisation imec have demonstrated progress toward integrating 2D-material transistors into 300mm semiconductor processes.

Funding and Commercial Plans

Nexstrom raised a $12 million seed round from investors including Xora Innovation, Foothill Ventures, and SEEDS, bringing its total funding to $15 million.

The company was incubated by Xora Innovation and was founded around research led by co-founder and chief scientist Lance Li, who previously worked on post-silicon electronics research at TSMC.

Nexstrom says the biggest challenge is producing consistent TMD materials across full-size wafers. The company is working on improving material quality, process control, and measurement systems while preparing for customer qualification programs.

The startup expects its equipment to move toward commercial production between 2030 and 2035 as it continues scaling its technology for semiconductor manufacturing.